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get the most out of the least home content code requests links about subscribe to feed pcbs (part 2) posted on 18 jul 2018, 20:57, by didier, under electronics , pcb , uncategorized . part 1 , 2 let’s exercise the tip and tricks that i shared with you in my latest post. here are the requirements for this subject: project: as a one idea per minute person, it was hard for me to stick to one project and one design. however, i had in mind the project of building an advanced direct digital synthesizer (dds), some sort of an improved (much improved) version of some early projects . this prototype is a real proof of concept prototype. instead of building it on a bread board, i decided to go for a pcb from scratch. here are the three good reasons to do so: all sections from the circuit are well known or have been individually and successfully tested; the inverter is a charge pump thus creating no cem troubles the mix of power supplies, digital and analog sections, the use of long component and wiring paths may create noisy signals and degrade the performances of the dds pcb’s are getting cheaper and available quickly without the burden of making them yourself. we’ll get back to this point in the next posts. cad tool: kicad, version v4.0.7. althought kicad v5 is available, i decided to go for the stable version. components: this project must contain a variety of sections (analog, digital, power supply) and components such as smds, through holes components, non plated through holes, headers. as this dds will be driven by an arduino uno board, the pcb will have this unique shield shape. warnings: this dds features both digital and analog sections which tracks shall be separated. the power supply section features an inverter in order to allow -5 v to +5 v output signal swing thus requiring clean power supply “buses”. care shall be taken to the position of headers and keepout areas (e.g. arduino uno usb connector). pcb: next picture illustrates the components placement on the shield: all active components are oriented in the same direction (pin 1 pointing the upper right corner of the board), same story for the polarized capacitors. all components are regularly spaced and labelled as shown below next pictures illustrate the copper layers (top and bottom) of the shield: on the top left are the dac and digital potentiometers, all spi, thus their location near portb. beneath is the analog section that includes the operational amplifiers and below is the power supply section. the analog potentiometers and push buttons are located on the right and side. note : although this dds is planned to be digitally driven, i made provision for analog pots and push buttons in order to offer a dual user interface, both analog and digital. under these conditions, analog pot positions shall be read and converted to digital for further frequency, amplitude and offset control. from this picture, you can see that all tracks are shielded and kept as short as possible. tests points are regrouped as much as possible (bottom left, upper left and upper mid area). see how bottom tracks are arranged: power supply and analog signal tracks are almost all vertical in order to prevent a spaghetti pcb. on the other hand, the spi buses are horizontal. as shown in the picture below, the chip select lines from the spi components are not isolated as they carry low frequency digital signals while the mosi and clk lines are isolated as they carry higher frequency signals. a careful look at the tracks shows that the rule “one pad one track” is mostly respected. vias are placed as far as possible from the pads in order to prevent thermal bridges as shown in the picture below. check also the presence of thermal reliefs for grounded pads. in this way, soldering is made easier and safer (for the components) as less heat must be applied to the pads in order to achieve the appropriate soldering temperature. last but not least, both copper sides feature large ground planes. thanks to clean routing, and moderate components density, no copper-less islands were created thus no extra vias were needed. if you need to pour copper in such island, this is how to create vias on kicad: create a “via” module (typically plated through hole, inner diameter: 0.3 mm, outer ring diameter: 0.6 mm). place the module at the convenient place (both sides at the same electrical potential). right click on the pad, edit “pad 1” (do not edit the entire module) and set the proper “net name” (e.g. gnd). note : such vias will be flushed if you reload the netfile using the “delete” “extra footprints”. to prevent this, create a via component, add it to the schematics and link the component to the module. tags: electronics , hardware , signal generator no comments » pcbs (part 1) posted on 18 jun 2018, 01:09, by didier, under electronics . part 1 , 2 pcb design pitfalls… a quick glance on the net brought me to various interesting web sites: “4 circuit board design mistakes to avoid” “pcb design – the top 5 mistakes” “6 pcb design mistakes to avoid designing printed circuit boards” “7 fatal mistakes to avoid on your pcb design” “top 9 mistakes that pcb engineers need avoid in pcb design” “top 10 pcb routing tips for beginners” “11 myths about pcb layout” … 4, 5, 6, 7, 9, 10, 11 ? is there really a limit to the number of pcb design pitfalls ? probably not. from the very early times when i was using an ink pen to draw the tracks on plain copper before immersion in iron perchloride up to now, i had my glorious and my inglorious times which were more or less related to the success in making nice clean flawless pcbs. so, based on my experiences, here is a list of reminders that i am sharing with you. footprints: always get the components that you will solder on a pcb, check there dimensions, check your footprint libraries. once routed, print the pcb copper layers and check the footprints. personally, i am using my very own footprint libraries in order to avoid mastikes. not plated holes (npth): unless your design is really screw-less, always provision holes for mounting your pcb on stands, posts or what so ever. (wire) routing : if the copper layers look nice, the routing is probably fine. spaghetti designs are almost always synonymous of trouble. simplify and shorten routes. check tracks width and maximize then when dealing with power supplies. avoid routing tracks between pins. thermal relief: choose proper copper widths. ban vias, plated holes, wide tracks located next to smd pins. avoid multiples tracks connect to a single pin. ground planes: always ! however ground planes may have an impact on some components: use keep out areas if necessary. all tracks carrying weak signals must be buried. thermal vias: although your prototype works great on the bench, the pcb may be used in harsh conditions and some components may insufficiently dissipate heat. create thermal vias beneath power components and have sweet dreams. cuts: did you check the overall dimensions of your pcb ? check it again this way: print the pcb on plain paper, glue this page on cardboard, cut along the edges and try to adjust this mock pcb to its destination. plain easy, plain beneficial. test points: always ! add test points to power supplies, critical signal points (inputs, outputs, driving pins, etc.). whenever possible, group the test points in order to facilitate the work of the troubleshooter. silk prints: always ! they are so usefull for identifying component references and orientations, test points, etc. be strict while placing text, apply your own rules, e.g. on top or on the right. always reference your pcb with a project name or code and above all with its revision name or code. wires: if you can, always tidy wires on one side. don’t you ever connect wires here and there in the middle of nowhere. that’s rude. connectors: less critical than wires however tidy connectors on the pcb edges, leave room around connectors so that clumsy fingers may be able to plug them. com

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